Infineon 650V 16A, SiC Schottky Diode, 10-Pin PG-HDSOP IDDD16G65C6XTMA1
- RS Stock No.:
- 216-8376P
- Mfr. Part No.:
- IDDD16G65C6XTMA1
- Brand:
- Infineon
Subtotal 2 units (supplied on a continuous strip)*
£3.36
(exc. VAT)
£4.04
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 370 unit(s) shipping from 13 October 2025
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Units | Per unit |
|---|---|
| 2 + | £1.68 |
*price indicative
- RS Stock No.:
- 216-8376P
- Mfr. Part No.:
- IDDD16G65C6XTMA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Mounting Type | Surface Mount | |
| Package Type | PG-HDSOP | |
| Maximum Continuous Forward Current | 16A | |
| Peak Reverse Repetitive Voltage | 650V | |
| Diode Configuration | Single | |
| Rectifier Type | Schottky Diode | |
| Diode Type | SiC Schottky | |
| Pin Count | 10 | |
| Number of Elements per Chip | 1 | |
| Diode Technology | SiC Schottky | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Mounting Type Surface Mount | ||
Package Type PG-HDSOP | ||
Maximum Continuous Forward Current 16A | ||
Peak Reverse Repetitive Voltage 650V | ||
Diode Configuration Single | ||
Rectifier Type Schottky Diode | ||
Diode Type SiC Schottky | ||
Pin Count 10 | ||
Number of Elements per Chip 1 | ||
Diode Technology SiC Schottky | ||
The Infineon IDD series schottky diode introduces double DPAK, the first top-side cooled surface mount device package addressing high power SMPS applications such as PC power, solar, server and telecom. It has current rating of 16 A. It provides a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions
