Infineon BGS12P2L6E6327XTSA1 RF Switch Circuit, 6-Pin TSLP-6-4
- RS Stock No.:
- 222-4774
- Mfr. Part No.:
- BGS12P2L6E6327XTSA1
- Brand:
- Infineon
Subtotal (1 reel of 15000 units)*
£1,995.00
(exc. VAT)
£2,400.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 02 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
15000 + | £0.133 | £1,995.00 |
*price indicative
- RS Stock No.:
- 222-4774
- Mfr. Part No.:
- BGS12P2L6E6327XTSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Infineon | |
Package Type | TSLP-6-4 | |
Pin Count | 6 | |
Mounting Type | Surface Mount | |
Dimensions | 0.7 x 1.1 x0.31mm | |
Select all | ||
---|---|---|
Brand Infineon | ||
Package Type TSLP-6-4 | ||
Pin Count 6 | ||
Mounting Type Surface Mount | ||
Dimensions 0.7 x 1.1 x0.31mm | ||
The Infineon BGS12P2L6 is a general purpose high power SPDT switch, designed to cover a broad range applications from 0.05 to 6 GHz and therefore excellent for 5G sub-6 GHz. Its outstanding RF performance optimizes the transmitting path (TRx) of LTE/5G mobile phones. The chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally.
Leadless and halogen free package TSLP-6-4
Size: 0.7 x 1.1 mm2 and thickness of 0.31 mm
No power supply decoupling required
High EMI robustness
RoHS and WEEE compliant package
Size: 0.7 x 1.1 mm2 and thickness of 0.31 mm
No power supply decoupling required
High EMI robustness
RoHS and WEEE compliant package