Henkel Loctite HF212 90iSC DAP Lead Free Solder Paste, 500g Jar
- RS Stock No.:
- 832-9769
- Mfr. Part No.:
- 1816946
- Brand:
- Henkel
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 832-9769
- Mfr. Part No.:
- 1816946
- Brand:
- Henkel
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Henkel | |
Lead Free | Yes | |
Trade Name | Loctite HF212 90iSC DAP | |
Package Type | Jar | |
Package Size | 500g | |
Select all | ||
---|---|---|
Brand Henkel | ||
Lead Free Yes | ||
Trade Name Loctite HF212 90iSC DAP | ||
Package Type Jar | ||
Package Size 500g | ||
- COO (Country of Origin):
- HU
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Solder Paste - Lead Free
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