The Loctite MP 218 solder paste is a halide-free, no clean, pin testable solder paste, which has excellent humidity resistance and a broad process window, both for reflow and printing. LOCTITE MP 218 has high tack force to resist component movement during high speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen and across a wide range of surface finishes including HASL, Ni/Au, Immersion Sn, Immersion Ag and OSP copper.

Colourless residues for easy post-reflow inspection
Soft, non-stick, pin testable residues allow easy in-circuit testing
Suitable for fine pitch, high speed printing up to 150mm/s (6"/s)