Casting compound for encapsulating electronic assembliesVibration isolation and prevention of stress exposureER 2074 RS stock no. 160-8469 — very high thermal transfer properties (thermal conductivity of 1.26W/mK)Entirely free of grinding fillersLow heat emission upon hardeningAt a storage or transport temperature below 10 °C, the product may contain small clots as a result of crystallisation, which impedes its use with dispensing systems. Upon heating to max. 50 °C, crystals dissolve againER 2183 RS stock no. 337-5919 — high thermal transfer properties, oil-resistant

The Electrolube 250g epoxy resin is a flame retardant, thermally conductive, 2-part potting and encapsulating compound. This technology used is of the ’clean’ type, leading to relatively low toxicity fumes and low smoke emission.

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Very high thermal properties
• Entirely free of grinding fillers
• Low heat emission upon hardening
• High thermal conductivity

• LEDs
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Ceramic
• Rubber
• Plastic
• Glass

Potting Compounds: Twin Packs