MG Chemicals 832FX-1.7L Epoxy Potting Compound 1.7 L
- RS Stock No.:
- 146-2869
- Mfr. Part No.:
- 832FX-1.7L
- Brand:
- MG Chemicals
Stock information currently inaccessible
- RS Stock No.:
- 146-2869
- Mfr. Part No.:
- 832FX-1.7L
- Brand:
- MG Chemicals
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | MG Chemicals | |
| Product Material | Epoxy | |
| Package Type | Can | |
| Package Size | 1.7 L | |
| Special Properties | Chemical Resistance, Harsh Resistance, Salt Water Resistance | |
| Cure Time | 48 h @ +25°C | |
| Hardness | 88 Shore A | |
| Thermal Conductivity | 0.26W/mK | |
| Maximum Operating Temperature | +140°C | |
| Minimum Operating Temperature | -40°C | |
| Dielectric Strength | 15.7 kV/mm, 400 V/mil | |
| Operating Temperature Range | -40 → +140 °C | |
| Viscosity Measurement | 165 (Part B) cP, 800 (Part A) cP | |
| Volume Resistivity | 5.8 x 10^12Ω cm | |
| Odour | Ammoniacal, Sulphurous | |
| Physical Form | Liquid | |
| Select all | ||
|---|---|---|
Brand MG Chemicals | ||
Product Material Epoxy | ||
Package Type Can | ||
Package Size 1.7 L | ||
Special Properties Chemical Resistance, Harsh Resistance, Salt Water Resistance | ||
Cure Time 48 h @ +25°C | ||
Hardness 88 Shore A | ||
Thermal Conductivity 0.26W/mK | ||
Maximum Operating Temperature +140°C | ||
Minimum Operating Temperature -40°C | ||
Dielectric Strength 15.7 kV/mm, 400 V/mil | ||
Operating Temperature Range -40 → +140 °C | ||
Viscosity Measurement 165 (Part B) cP, 800 (Part A) cP | ||
Volume Resistivity 5.8 x 10^12Ω cm | ||
Odour Ammoniacal, Sulphurous | ||
Physical Form Liquid | ||
- COO (Country of Origin):
- CA
The 832FX Black Flexible Epoxy Encapsulating and Potting Compound is an economical, electronic-grade, two-part system that is flowable. Its cured form is flexible offering excellent physical, chemical, and electrical protection, and providing some small amount of thermal conductivity. It protects against static discharges, thermal shocks, vibrations, and mechanical impacts. It is extremely resistant to environmental humidity, salt water, and harsh chemicals. It also hides and restrict access to intellectual property by being much harder to remove than standard epoxy encapsulating compounds.
Flexible and high durability
Mix ratio 1A:1B compatible with most dispensing equipment
Resistance to water and humidity
Protects electronics from moisture, corrosion, fungus, thermal shock, and static discharges
Flowable and free of solvent parts
Mix ratio 1A:1B compatible with most dispensing equipment
Resistance to water and humidity
Protects electronics from moisture, corrosion, fungus, thermal shock, and static discharges
Flowable and free of solvent parts