Molex PMC Mezzanine Series Straight Surface Mount PCB Socket, 64-Contact, 2-Row, 1.0mm Pitch, Solder Termination
- RS Stock No.:
- 797-6617P
- Mfr. Part No.:
- 71439-0864
- Brand:
- Molex
Bulk discount available
Subtotal 20 units (supplied on a continuous strip)*
£60.20
(exc. VAT)
£72.20
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 196 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 20 - 74 | £3.01 |
| 75 - 299 | £2.77 |
| 300 - 599 | £2.53 |
| 600 + | £2.39 |
*price indicative
- RS Stock No.:
- 797-6617P
- Mfr. Part No.:
- 71439-0864
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Pitch | 1.0mm | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Connector System | Board to Board | |
| Termination Method | Solder | |
| Current Rating | 1.0A | |
| Voltage Rating | 100.0 V | |
| Series | PMC Mezzanine | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Series Number | 71439 | |
Select all | ||
|---|---|---|
Brand Molex | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Pitch 1.0mm | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Connector System Board to Board | ||
Termination Method Solder | ||
Current Rating 1.0A | ||
Voltage Rating 100.0 V | ||
Series PMC Mezzanine | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Series Number 71439 | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component