The TE Connectivity AMPMODU Small Centerline Interconnection Systems are fine pitch 1.0 mm connectors that offer 85 percent space savings on the board when compared to standard 2.54 mm pitch products. Their dual beam contact design provides a reliable electrical connection even in severe shock and vibration environments. To serve a broad range of design requirements, the portfolio offers up to 100 positions with 2 plating options and supports automated surface mounting and reflow processes.

Improved durability and corrosion resistance with gold plating
Time savings thanks to reflow capable materials
Greater flexibility in assembly of boards with dual entry receptacles