Samtec ADF6 Series Vertical PCB Socket, 20-Contact, 4-Row, 0.635mm Pitch, Solder Termination
- RS Stock No.:
- 202-7886
- Mfr. Part No.:
- ADF6-20-03.5-L-4-2-A
- Brand:
- Samtec
Bulk discount available
Subtotal (1 tape of 100 units)*
£1,402.90
(exc. VAT)
£1,683.50
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 999,999,900 unit(s) shipping from 11 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tape* |
---|---|---|
100 - 100 | £14.029 | £1,402.90 |
200 + | £13.258 | £1,325.80 |
*price indicative
- RS Stock No.:
- 202-7886
- Mfr. Part No.:
- ADF6-20-03.5-L-4-2-A
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Samtec | |
Number of Contacts | 20 | |
Number of Rows | 4 | |
Pitch | 0.635mm | |
Type | High-Density Socket | |
Body Orientation | Vertical | |
Termination Method | Solder | |
Series | ADF6 | |
Series Number | 6 | |
Select all | ||
---|---|---|
Brand Samtec | ||
Number of Contacts 20 | ||
Number of Rows 4 | ||
Pitch 0.635mm | ||
Type High-Density Socket | ||
Body Orientation Vertical | ||
Termination Method Solder | ||
Series ADF6 | ||
Series Number 6 | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design
Low profile 5 mm stack height and slim 5 mm width
4-row design
10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development