TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Socket, 40-Contact, 2-Row, 1.27mm Pitch, Solder
- RS Stock No.:
- 406-855P
- Mfr. Part No.:
- 5-104652-4
- Brand:
- TE Connectivity
Subtotal 1 unit (supplied in a tube)*
£5.76
(exc. VAT)
£6.91
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 29 September 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 1 + | £5.76 |
*price indicative
- RS Stock No.:
- 406-855P
- Mfr. Part No.:
- 5-104652-4
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Pitch | 1.27mm | |
| Type | Socket Strip | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Current Rating | 12A | |
| Voltage Rating | 30 V | |
| Series | AMPMODU System 50 | |
| Contact Material | Copper | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Pitch 1.27mm | ||
Type Socket Strip | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Termination Method Solder | ||
Current Rating 12A | ||
Voltage Rating 30 V | ||
Series AMPMODU System 50 | ||
Contact Material Copper | ||
TE connectivity AMPMODU 50/50 1.27mm x 1.27mm Grid Board to Board Vertical Receptacles
AMPMODU 50/50 1.27mm x 1.27mm grid board to board vertical receptacles for SMT parallel board to board stacking in high density .050 x .050 applications. Parallel board to board stack heights of 6.35mm, 8.13mm and 9.91mm can by achieved using the same receptacle and selecting the appropriate header (board to board .050 x.050 double row vertical and right angle headers). These AMPMODU 50/50 1.27mm x 1.27mm vertical SMT board to board receptacle connectors have UL 94V-0 black glass filled thermoplastic housings, PCB hold down posts, polarizing tabs, gold plated contacts and are compatible with IR (infrared) and VPR(vapour phase reflow) surface mount processes.
Approvals
UL 94V-0
TE Connectivity AMPMODU 50/50 1.27mm Connectors
The TE Connectivity Modu 50/50 is a high density 1.27mm grid board to board connection system for SMT assembly. Choice of three different heights for PCB headers allows versatile stacking solutions to be achieved.