SMC series 1.27 mm pitch high-speed SMT vertical mount board to board signal connectors with a compact space saving design and high contact density. These SMC stacking signal connectors offer high performance, high signal integrity and reliability. The contacts of these SMC high-speed mezzanine signal connectors provides a continuous impedance profile enabling high transmission rates of up to 3 Gbit/s. The contacts have an ultra reliable dual beam design that provides a low resistance enabling high electrical performance. The housings of these 1.27mm SMC connectors have mating face polarization to prevent mis-mating and insertion chamfers for accurate insertion. Locating pegs on the bottom of the connector allow precise positioning on the PCB before soldering. Soldering brackets provide a high retention force on the PCB and absorb mechanical stress enabling a robust SMT connection and resistance to high shock and vibration. These 1.27mm SMC stacking connectors have a wide operating temperature range of -55 to +125°C making them suitable for use in various environments. The design of these SMC 1.27 mm connectors makes them suitable for fully automated board assembly. These SMC 1.27 mm board to board SMT connectors are available with various stacking heights for design flexibility.

Compact high density design
Ultra reliable dual beam contact design
High-speed signal rates of up to 3 Gbit/s
Polarization for accurate mating
Locating pegs for PCB placement
Soldering brackets for secure PCB retention
Wide operating temperature range
Range of unmated stacking heights
Suitable for fully automated board assembly

These SMC 1.27 mm stacking signal connectors can be used for board to board mezzanine applications in unshielded high-speed applications across a wide range of industries. These industries include industrial, automotive, communications, medical applications and consumer applications

These SMC 1.27 mm stacking signal connectors can be used for board to board mezzanine applications in unshielded high-speed applications across a wide range of industries. These industries include industrial, automotive, communications, medical applications and consumer applications

•Compact high density design