Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Through hole versions SMT compatible
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solderable retention clips for PCB retention
Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications. Applications include Military COTS (Commercial Off The Shelf), solar power, consumer products, data communications, medical, telecommunications and gaming terminals

Molex Micro-Fit 3.0 Series