Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 18 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 pack of 5 units)*

£27.82

(exc. VAT)

£33.385

(inc. VAT)

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Units
Per unit
Per Pack*
5 - 95£5.564£27.82
100 - 370£4.46£22.30
375 - 1495£3.878£19.39
1500 - 2995£3.228£16.14
3000 +£3.00£15.00

*price indicative

Packaging Options:
RS Stock No.:
670-2077
Mfr. Part No.:
43045-1815
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

Micro-Fit 3.0

Current

5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

18

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

COO (Country of Origin):
US

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Press fit retention clips for PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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