Molex 43045 Series Right Angle Surface Mount PCB Header, 8 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Solder tabs for secure connection to PCB
• Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header is a high-performance component designed for surface mount applications. Featuring a 3.0mm pitch, it consists of 8 contacts arranged in a dual-row format. The right angle orientation and shrouded design offer enhanced usability and integration for various electronic assemblies. Constructed from durable brass and plated with tin, it ensures reliable connectivity in demanding environments.

• Shrouded design prevents accidental contact, enhancing safety
• Dual row configuration allows for compact layouts in PCBs
• Right angle orientation simplifies connections in tight spaces
• Rated for a maximum current of 8.5A for high-power applications
• Supports voltages up to 600V for robust electrical performance
• Durable solder termination provides a stable connection on boards

• Ideal for power connections in automation systems
• Utilised in wire-to-board configurations for electronic devices
• Suitable for various electrical requiring compact headers
• Commonly used in consumer electronics and industrial equipment

Yes, the solder process capability includes a maximum temperature of 260°C for up to 30 seconds, accommodating lead-free processes.

The recommended PCB thickness for this component is 1.60mm, ensuring secure retention on the board.

The component is designed for up to 30 mating cycles, which supports long-term reliability in frequent use scenarios.

Yes, it mates seamlessly with the 43025 Micro-Fit 3.0™ receptacle, ensuring flexibility in design choices.

The component complies with the 94V-0 flammability rating, making it suitable for applications where fire safety is a concern.

Molex Micro-Fit 3.0 Series