Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 20 Contact(s), 3 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 pack of 5 units)*

£17.93

(exc. VAT)

£21.515

(inc. VAT)

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5 - 95£3.586£17.93
100 - 370£2.548£12.74
375 - 1495£2.448£12.24
1500 - 2995£2.092£10.46
3000 +£2.01£10.05

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Packaging Options:
RS Stock No.:
670-0532
Mfr. Part No.:
43045-2000
Brand:
Molex
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Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Housing Material

High Temperature Thermoplastic

Number of Contacts

20

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Brass

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

Distrelec Product Id

304-42-682

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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