Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• Plastic peg PCB locks for secure connection to PCB
• Glow Wire Compliant

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header is designed for efficient wire-to-board connections in power applications. With a robust structure suitable for high-temperature environments, it ensures reliability in diverse electronic systems. The shrouded feature enhances stability, securing the connection for professionals in the automation and electronics sectors.

• Gold plating provides excellent conductivity and increased resistance to corrosion
• Supports a maximum current rating of 8.5A for high-current applications
• Compliant with glow wire ignition and flammability standards

• Power distribution in electronic devices
• Automation systems requiring secure connectors
• Household appliances for dependable connections

The shrouded design prevents accidental disconnections and misalignment during assembly, ensuring a secure fit and improving reliability.

The product is designed for optimal performance with a PCB thickness of 1.60mm, ensuring proper fit and dependable connections.

It operates within a temperature range of -40°C to +105°C, making it suitable for various environments.

The header is rated for up to 30 mating cycles, assuring longevity in repeated use.

Molex Micro-Fit 3.0 Series