Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 10 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

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Subtotal (1 pack of 5 units)*

£5.55

(exc. VAT)

£6.65

(inc. VAT)

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Temporarily out of stock
  • Shipping from 25 February 2026
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Units
Per unit
Per Pack*
5 - 20£1.11£5.55
25 - 45£0.944£4.72
50 - 95£0.868£4.34
100 - 245£0.844£4.22
250 +£0.824£4.12

*price indicative

Packaging Options:
RS Stock No.:
447-6934
Mfr. Part No.:
43650-1015
Brand:
Molex
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Brand

Molex

Series

Micro-Fit 3.0

Pitch

3.0mm

Number of Contacts

10

Number of Rows

1

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mounting Type

Through Hole

Connector System

Wire to Board

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43650

Current Rating

5.0A

Voltage Rating

250.0 V

COO (Country of Origin):
US

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

• Kinked solder legs for additional PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals


Molex Micro-Fit 3.0 Series

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