Molex C-Grid III Series Vertical Through Hole PCB Header, 16 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded

This shrouded PCB header facilitates efficient wire-to-board connections. The Molex C-Grid III™ provides a dependable solution for applications requiring a robust electrical interface, enabling seamless signal transfer within circuit boards. With its vertical orientation and compact design, it is suitable for a variety of electronic configurations, optimising space and performance.

• Gold plating on header connector offers corrosion resistance
• Supports up to 3A current for steady power transmission
• Durable construction tolerates up to 100 mating cycles

• Used in automation equipment for signal transfer
• Employed in electronic devices requiring reliable connections
• Suitable for interconnecting circuit boards in commercial

The maximum voltage rating is 350V AC/DC, ensuring safe operation in high-voltage applications.

A PCB thickness of 1.60mm is ideal for ensuring proper alignment and functionality.

It supports 16 circuits, providing sufficient connections for complex wiring needs.

Yes, it operates within a temperature range of -55°C to +125°C, making it suitable for diverse operational environments.

DIN 41651; HE13/14

2.54mm Molex C-Grid III Range