Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54 mm Pitch, 1 Row(s),
- RS Stock No.:
- 236-4663
- Mfr. Part No.:
- 77311-124-03LF
- Brand:
- Amphenol Communications Solutions
Bulk discount available
Subtotal (1 bag of 1000 units)*
£156.00
(exc. VAT)
£187.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 11 February 2026
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Units | Per unit | Per Bag* |
|---|---|---|
| 1000 - 1000 | £0.156 | £156.00 |
| 2000 + | £0.144 | £144.00 |
*price indicative
- RS Stock No.:
- 236-4663
- Mfr. Part No.:
- 77311-124-03LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Product Type | Pin Header | |
| Series | Bergstik | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Product Type Pin Header | ||
Series Bergstik | ||
Pitch 2.54mm | ||
Current 3A | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
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