Amphenol Communications Solutions PCB Header, Shrouded
- RS Stock No.:
- 182-3083
- Mfr. Part No.:
- 61083-184402LF
- Brand:
- Amphenol Communications Solutions
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 182-3083
- Mfr. Part No.:
- 61083-184402LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Shrouded/Unshrouded | Shrouded | |
| Termination Method | Solder | |
Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Shrouded/Unshrouded Shrouded | ||
Termination Method Solder | ||
- COO (Country of Origin):
- CN
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.