Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

This PCB header facilitates a dependable connection for wire-to-board applications, tailored for high-current situations. The Micro-Fit 3.0 structure features a shrouded design that improves the connector's compatibility and operational stability. With a current rating of 8.5A and a voltage rating of 600V, it meets the requirements of the automation, electronics, and electrical sectors.

• Tin plating provides corrosion resistance and conductivity
• Glow wire compliant for safety in elevated temperature environments
• High durability with 30 mating cycles for extended use

• Utilised in power distribution and control systems
• Suitable for automation equipment needing compact connectors
• Ideal for electronic devices requiring secure wire-to-board connections

The optimal PCB thickness for this connector is 1.60mm, ensuring effective retention and stability during operation.

Yes, it can handle a maximum process temperature of 260°C for up to 30 seconds, making it suitable for lead-free solder processes.

This header supports up to 4 circuits, offering flexibility for various power and signal connection requirements.

Yes, with a maximum current rating of 8.5A per contact, it is appropriate for high-current PCB connections.

Molex Micro-Fit 3.0 Series