Molex 41771 Series Vertical Through Hole PCB Header Pin, 6 Contact(s), 3.96mm Pitch, 1 Row(s), Unshrouded
- RS Stock No.:
- 685-064
- Mfr. Part No.:
- 26-60-2031
- Brand:
- Molex
Subtotal (1 pack of 1000 units)*
£200.45
(exc. VAT)
£240.54
(inc. VAT)
Stock information currently inaccessible
Pack(s) | Per Pack | Per unit* |
---|---|---|
1 + | £200.45 | £0.20 |
*price indicative
- RS Stock No.:
- 685-064
- Mfr. Part No.:
- 26-60-2031
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Series | 41771 | |
Pitch | 3.96mm | |
Number of Contacts | 6 | |
Number of Rows | 1 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Unshrouded | |
Mounting Type | Through Hole | |
Select all | ||
---|---|---|
Brand Molex | ||
Series 41771 | ||
Pitch 3.96mm | ||
Number of Contacts 6 | ||
Number of Rows 1 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Through Hole | ||
- COO (Country of Origin):
- IN
The Molex flat vertical header assembly is specifically designed for seamless connectivity in electronic applications. Featuring a robust construction with glass-filled polyester, this component ensures reliability and durability in demanding environments. It accommodates standard solderability practices, achieving excellent performance while maintaining compliance with cosmetic specifications. Its stackable design promotes efficient space management on circuit boards, making it an optimal choice for modern electronics. This header is engineered to withstand various mechanical stresses and is compatible with multiple wiring configurations, offering versatility for designers and engineers. Whether for prototype development or mass assembly, this header assembly delivers exceptional functionality.
Constructed from glass-filled polyester ensuring durability
Meets overall refloated matte tin specifications for enhanced performance
Supports a pin push-out force of 3 lbs minimum prior to soldering
Stackable design allows for efficient end to end component placement
Compatible with various PC board hole layouts for easy integration
Features void-free circuits for reliable electrical connections
Conforms to class B requirements of cosmetic specifications
Recommended for high-quality electronic assemblies in diverse markets
Meets overall refloated matte tin specifications for enhanced performance
Supports a pin push-out force of 3 lbs minimum prior to soldering
Stackable design allows for efficient end to end component placement
Compatible with various PC board hole layouts for easy integration
Features void-free circuits for reliable electrical connections
Conforms to class B requirements of cosmetic specifications
Recommended for high-quality electronic assemblies in diverse markets
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