Phoenix Contact DMC Series Straight Through Hole PCB Header, 14 Contact(s), 3.5 mm Pitch, 2 Row(s), Shrouded

Subtotal (1 pack of 50 units)*

£600.12

(exc. VAT)

£720.14

(inc. VAT)

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Pack(s)
Per Pack
Per unit*
1 +£600.12£12.002

*price indicative

RS Stock No.:
517-077
Mfr. Part No.:
1787137
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Series

DMC

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

14

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON DFMC 1

Mount Type

Through Hole

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3.5mm

Contact Gender

Male

Tail Pin Length

2mm

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

2mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact sophisticated PCB header designed for optimal integration into SMT soldering processes. This product showcases superior mechanical stability due to its screwable flange, along with innovative locking and release mechanisms for ease of use. With a compact design tailored for applications where space is limited, it's a reliable choice for connecting multiple potentials. The device supports high contact density, enabling efficient connectivity across a wide array of circuits. Its robust technical specifications ensure longevity and durability, making it suitable for various applications in today's electronic environments.

Engineered for seamless SMT soldering integration

Comprises a screwable flange for enhanced mechanical stability

Features an intuitive lock-and-release mechanism for user-friendliness

Facilitates multi-level conductor connections for dense arrangements

Compact footprint ideal for space-constrained applications

Manufactured to high standards of quality and compliance

Equipped with a Linear pin layout for straightforward PCB design

Tested for durability and reliability across diverse environmental conditions

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