Phoenix Contact MCDNV Series Vertical Through Hole PCB Header, 8 Contact(s), 3.81 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 pack of 70 units)*

£296.68

(exc. VAT)

£356.02

(inc. VAT)

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RS Stock No.:
492-769
Mfr. Part No.:
1750122
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

MCDNV

Pitch

3.81mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Nickel, Tin

Minimum Operating Temperature

-40°C

Row Pitch

3.81mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

100°C

Tail Pin Length

1.4mm

Mating Pin Length

1.4mm

Standards/Approvals

cULus Recognised E60425-20110128, IEC 60068-2-82, IEC 60112, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, ISO 6988, JEDEC JESD 201, UL 94 V0, VDE 40011723

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header is an ideal solution for connecting components within electronic devices, offering robust performance in a compact form factor. Designed with a pitch of 3.81 mm, it enables efficient space utilisation on printed circuit boards. Crafted for through-hole reflow and wave soldering processes, this product enhances integration into automated manufacturing systems. With its versatile design, it supports multiple connection technologies, making it highly adaptable for various applications. The black housing, constructed from quality insulating material, ensures reliability in demanding environments, while its tin-plated contacts guarantee excellent conductivity. This component not only meets stringent safety standards but also provides exceptional durability against heat and mechanical stress, making it a trusted choice for engineers and designers alike.

Facilitates efficient PCB layouts with compact dimensions

Ensures reliable connections through the use of high-grade materials

Optimised for use in automated assembly processes

Promotes design flexibility with its broad compatibility

Effectively withstands harsh operating conditions

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