TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 12 Contact(s), 1.27mm Pitch, 2 Row(s), Shrouded

Subtotal (1 tube of 111 units)*

£190.68

(exc. VAT)

£228.82

(inc. VAT)

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  • Shipping from 17 November 2025
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Tube(s)
Per Tube
Per unit*
1 +£190.68£1.718

*price indicative

RS Stock No.:
480-261
Mfr. Part No.:
104068-8
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Pitch

1.27mm

Number of Contacts

12

Number of Rows

2

Body Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mounting Type

Board Mount

Non Compliant

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for vertical board-to-board applications, offering an exceptional connection with a fully shrouded design. Benefiting from a 12-position configuration on a compact 1.27 mm centerline, it provides reliability and performance for various electronic devices. The product features a sturdy construction that can withstand both high operational temperatures and electrical stress. With a gold contact finish and nickel underplating, this header ensures excellent conductivity and durability, making it suitable for demanding environments. It adheres to rigorous industry standards, offering peace of mind through its compatibility with CSA and UL requirements. Enhanced with a practical latching mechanism, this header not only supports easy mating but also secures connections firmly in place. Ideal for professionals seeking dependable solutions, this PCB Mount Header embodies engineering excellence combined with convenience and performance.

Designed for secure board-to-board connections in vertical configurations
Utilizes high-quality materials for enhanced durability and performance
Features a fully shrouded design that protects contacts from damage
Capable of operating within a broad temperature range for versatile applications
Latching mechanism provides a reliable connection that prevents accidental disconnections
Ideal for use in various industries, complying with stringent safety standards
Compact size allows for space-efficient design in electronic assemblies