TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 10 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 473-716
- Mfr. Part No.:
- 103169-3
- Brand:
- TE Connectivity
Subtotal (1 tray of 240 units)*
£576.84
(exc. VAT)
£692.21
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 24 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £576.84 | £2.404 |
*price indicative
- RS Stock No.:
- 473-716
- Mfr. Part No.:
- 103169-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Series | AMPMODU | |
Pitch | 2.54mm | |
Number of Contacts | 10 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Board Mount | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Pitch 2.54mm | ||
Number of Contacts 10 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Board Mount | ||
Non Compliant
- COO (Country of Origin):
- US
The TE Connectivity PCB Mount Header is an essential component designed for reliable, vertical board-to-board connections. Featuring fully shrouded connectors, this product ensures a snug fit and maximum protection against potential disruptions. With 10 positions arranged in 2 rows and a standard 2.54 mm centreline, its tailored for efficient space management on printed circuit boards. This versatile connector suits a variety of applications, from consumer electronics to automotive systems, providing a dependable interface for signal transmission. Its advanced design includes gold and nickel plating to enhance performance and durability, making it a top choice for engineers seeking quality and reliability in connectivity solutions.
Fully shrouded design prevents accidental disconnections
Optimised for board to board applications ensuring efficient signal transfer
Supports a broad operating temperature range catering to diverse environmental conditions
Constructed from thermoplastic for superior durability and resilience
Polarisation feature simplifies the mating process reducing assembly time
Compact footprint maximises space utilisation on PCBs
Compatible with various industry standards enhancing integration flexibility
Optimised for board to board applications ensuring efficient signal transfer
Supports a broad operating temperature range catering to diverse environmental conditions
Constructed from thermoplastic for superior durability and resilience
Polarisation feature simplifies the mating process reducing assembly time
Compact footprint maximises space utilisation on PCBs
Compatible with various industry standards enhancing integration flexibility