Molex 505004 Series Vertical Surface PCB Header, 8 Contact(s), 0.4 mm Pitch, 2 Row(s), Shrouded

Subtotal (1 tray of 3000 units)*

£1,139.74

(exc. VAT)

£1,367.69

(inc. VAT)

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Tray(s)
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Per unit*
1 +£1,139.74£0.38

*price indicative

RS Stock No.:
473-294
Mfr. Part No.:
505004-0810
Brand:
Molex
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Brand

Molex

Series

505004

Product Type

PCB Header

Pitch

0.4mm

Current

3A

Number of Contacts

8

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Contact Material

Copper Alloy

Contact Plating

Gold over Nickel

Row Pitch

0.4mm

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Maximum Operating Temperature

85°C

Standards/Approvals

REACH, RoHS

Voltage

50 Vrms

Distrelec Product Id

304-56-532

COO (Country of Origin):
KR
The TE Connectivity connector solution is engineered for precision in board-to-board applications, providing reliable connectivity in compact spaces. Designed with a 0.40mm pitch, the receptacle optimises performance while maintaining a low profile. Its hybrid design accommodates four power and four signal contacts, ensuring robust electrical performance and versatility for various circuit configurations. Made from high-quality materials, including a liquid crystal polymer housing and copper alloys, this connector offers durability and environmental compliance. Ideal for applications requiring dependable mating and minimal footprint, it supports temperatures ranging from -40° to +85°C, making it suitable for a wide range of operating conditions. The slim profile and thoughtful design make it a perfect choice for modern electronic assemblies, where space and efficiency are paramount.

Compact design enhances board layout flexibility

Supports both power and signal connections, streamlining electronic design

Constructed from halogen-free materials for improved environmental safety

Backed by rigorous durability standards for reliable performance

Surface mount termination style simplifies assembly processes

Optimal operating temperature range ensures functionality across diverse environments

Vertical orientation allows for efficient space utilisation in tight configurations

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