TE Connectivity MTA 156 Series Right Angle Board Mount PCB Header, 15 Contact(s), 3.96mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 pack of 150 units)*

£213.08

(exc. VAT)

£255.70

(inc. VAT)

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  • Shipping from 24 November 2025
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Pack(s)
Per Pack
Per unit*
1 +£213.08£1.421

*price indicative

RS Stock No.:
473-200
Mfr. Part No.:
1-640385-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

MTA 156

Pitch

3.96mm

Number of Contacts

15

Number of Rows

1

Body Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Mounting Type

Board Mount

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is designed for efficient wire-to-board connectivity, offering a robust solution for applications requiring reliability and performance. This connector features a right-angle orientation, making it ideal for space-constrained environments where PCB layout is critical. With 15 positions, it provides ample connection points, while its unshrouded design simplifies mating and enables easier handling. The component is engineered to support through-hole soldering, ensuring a secure fit on your printed circuit board. Built to withstand demanding electrical conditions, including a high operating voltage, this header is suitable for various applications across different industries. Its nickel underplating and tin-plated contacts enhance conductivity and durability, ensuring long-term operation in challenging settings.

Designed for wire-to-board applications to provide reliable electrical connections
Right-angle orientation facilitates compact PCB layouts
15 positions enhance versatility for multiple functionalities
Unshrouded design allows for straightforward alignment and mating
Through-hole soldering method ensures a permanent attachment to the PCB
Compatible with high voltage operations to support demanding environments
Nickel underplating improves contact conductivity and resistance to wear
Tin-plated contacts help prevent corrosion for extended service life
Thermoplastic polyester housing guarantees structural integrity under heat
Optimised for wave soldering, simplifying manufacturing processes