TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 18 Contact(s), 2.54mm Pitch, 2 Row(s), Unshrouded
- RS Stock No.:
- 472-071
- Mfr. Part No.:
- 5-103233-8
- Brand:
- TE Connectivity
Subtotal (1 pack of 25 units)*
£186.66
(exc. VAT)
£223.99
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 27 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s) | Per Pack | Per unit* |
|---|---|---|
| 1 + | £186.66 | £7.466 |
*price indicative
- RS Stock No.:
- 472-071
- Mfr. Part No.:
- 5-103233-8
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Series | AMPMODU | |
| Pitch | 2.54mm | |
| Number of Contacts | 18 | |
| Number of Rows | 2 | |
| Body Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mounting Type | Board Mount | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Pitch 2.54mm | ||
Number of Contacts 18 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Board Mount | ||
- COO (Country of Origin):
- MX
The TE Connectivity PCB Mount Header is engineered to facilitate efficient board-to-board connections, offering robust performance for various electronic applications. Its unique unshrouded design allows for easy mating and alignment in confined spaces, making it an ideal choice for compact electronic assemblies. With a vertical mount orientation, this connector supports an 18-position and 2-row configuration, ensuring versatility in design. Constructed from high-quality thermoplastic with a reliable nickel underplating, it not only withstands high operational temperatures but also provides durability for long-term use. The header's compatibility with multiple standards highlights its reliability, making it a preferred solution among engineers seeking integration in complex systems.
Unshrouded design allows for easier alignment and mating
Vertical orientation optimises space efficiency in electronic applications
Constructed from durable thermoplastic to endure high temperatures
Nickel underplating enhances connection reliability and longevity
Designed to meet various industry standards for compatibility
Robust contact rating supports maximum current loading capabilities
Efficient packaging method reduces shipping waste and environmental impact
Vertical orientation optimises space efficiency in electronic applications
Constructed from durable thermoplastic to endure high temperatures
Nickel underplating enhances connection reliability and longevity
Designed to meet various industry standards for compatibility
Robust contact rating supports maximum current loading capabilities
Efficient packaging method reduces shipping waste and environmental impact