Infineon 3-Axis Surface Position Sensor 2.8 V 24 V, I2C, TSOP, 6-Pin
- RS Stock No.:
- 233-3503
- Mfr. Part No.:
- TLE493DP2B6A1HTSA1
- Brand:
- Infineon
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 233-3503
- Mfr. Part No.:
- TLE493DP2B6A1HTSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Position Sensor | |
| Sensor Type | Motion Sensor Module | |
| Number of Axis | 3 | |
| Technology | Digital | |
| Mount Type | Surface | |
| Interface Type | I2C | |
| Maximum Frequency Response | 100kHz | |
| Minimum Frequency Response | 5.5kHz | |
| Minimum Supply Voltage | 2.8V | |
| Package Type | TSOP | |
| Maximum Supply Voltage | 24V | |
| Minimum Operating Temperature | -40°C | |
| Pin Count | 6 | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Length | 2.9mm | |
| Height | 1.1mm | |
| Series | TLE493D-P2B6 | |
| Width | 1.6 mm | |
| Supply Current | 3.4mA | |
| Automotive Standard | AEC-Q100 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Position Sensor | ||
Sensor Type Motion Sensor Module | ||
Number of Axis 3 | ||
Technology Digital | ||
Mount Type Surface | ||
Interface Type I2C | ||
Maximum Frequency Response 100kHz | ||
Minimum Frequency Response 5.5kHz | ||
Minimum Supply Voltage 2.8V | ||
Package Type TSOP | ||
Maximum Supply Voltage 24V | ||
Minimum Operating Temperature -40°C | ||
Pin Count 6 | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Length 2.9mm | ||
Height 1.1mm | ||
Series TLE493D-P2B6 | ||
Width 1.6 mm | ||
Supply Current 3.4mA | ||
Automotive Standard AEC-Q100 | ||
The Infineon TLE493D-P2B6 has extremely low quiescent current and wake up function in small package. Also the sensor provides options for configuration to fit best to customer requirements.
Platform adaptability due to device configurability
Wide application range addressable due to high flexibility
Component reduction due to 3D magnetic measurement principle
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