InvenSense 9-Axis Surface Mount Accelerometer & Gyroscope, QFN, I2C, SPI, 24-Pin
- RS Stock No.:
- 218-2214P
- Mfr. Part No.:
- ICM-20948
- Brand:
- InvenSense
Bulk discount available
Subtotal 100 units (supplied on a continuous strip)*
£482.00
(exc. VAT)
£578.00
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 1,142 unit(s) shipping from 06 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
100 - 498 | £4.82 |
500 - 998 | £4.67 |
1000 - 2498 | £4.545 |
2500 + | £4.435 |
*price indicative
- RS Stock No.:
- 218-2214P
- Mfr. Part No.:
- ICM-20948
- Brand:
- InvenSense
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | InvenSense | |
Sensor Type | Motion Sensor Module | |
Number of Axis | 9 | |
Technology | Digital | |
Mounting Type | Surface Mount | |
Interface Type | I2C, SPI | |
Package Type | QFN | |
Pin Count | 24 | |
Select all | ||
---|---|---|
Brand InvenSense | ||
Sensor Type Motion Sensor Module | ||
Number of Axis 9 | ||
Technology Digital | ||
Mounting Type Surface Mount | ||
Interface Type I2C, SPI | ||
Package Type QFN | ||
Pin Count 24 | ||
- COO (Country of Origin):
- TW
The InvenSense ICM series is the worlds lowest power 9-axis motion tracking device that is ideally suited for smartphones, tablets, wearable sensors, and IoT applications. It combines 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, and a digital motion processor. The gyroscope has a programmable full-scale range of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps. The accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. It also features a 1 KB FIFO that can lower the traffic on the serial bus interface.
Android support
On-chip 16-bit ADCs and programmable filters
Digital-output temperature sensor
MEMS structure hermetically sealed and bonded at wafer level
On-chip 16-bit ADCs and programmable filters
Digital-output temperature sensor
MEMS structure hermetically sealed and bonded at wafer level