TDK 470nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±20% , SMD
- RS Stock No.:
- 916-3131
- Mfr. Part No.:
- C5750X7T2J474M250KE
- Brand:
- TDK
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 916-3131
- Mfr. Part No.:
- C5750X7T2J474M250KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 470nF | |
| Voltage | 630V dc | |
| Package/Case | 2220 (5750M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7T | |
| Tolerance | ±20% | |
| Dimensions | 5.7 x 5 x 2.5mm | |
| Length | 5.7mm | |
| Depth | 5mm | |
| Height | 2.5mm | |
| Series | C | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
| Terminal Type | Surface Mount | |
Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 470nF | ||
Voltage 630V dc | ||
Package/Case 2220 (5750M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±20% | ||
Dimensions 5.7 x 5 x 2.5mm | ||
Length 5.7mm | ||
Depth 5mm | ||
Height 2.5mm | ||
Series C | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
Terminal Type Surface Mount | ||
TDK C Series 2220 (5750) Soft Terminal
Soft Termination C Series MLCC have improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties
thermal shock resistance, and heat cycle properties
• Conductive resin absorb external stress to protect solder joint parts and capacitor body
• Compliance with the RoHS Directive
• Compliance with the RoHS Directive
Applications:
• Switching power supply
• Telecom base station
• Electronic circuits mounted on alumina substrate
• SMT application which requires bending robustness in which solder joint reliability is problematic
• Telecom base station
• Electronic circuits mounted on alumina substrate
• SMT application which requires bending robustness in which solder joint reliability is problematic