Murata 1μF MLCC, 6.3V dc V, ±10% , SMD
- RS Stock No.:
- 185-3187
- Mfr. Part No.:
- GMD155R60J105KE11D
- Brand:
- Murata
Subtotal (1 reel of 10000 units)*
£2,200.00
(exc. VAT)
£2,600.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 29 January 2026
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Units | Per unit | Per Reel* |
---|---|---|
10000 + | £0.22 | £2,200.00 |
*price indicative
- RS Stock No.:
- 185-3187
- Mfr. Part No.:
- GMD155R60J105KE11D
- Brand:
- Murata
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Murata | |
Capacitance | 1µF | |
Voltage | 6.3V dc | |
Package/Case | 0402 (1005M) | |
Mounting Type | Surface Mount | |
Dielectric | X5R | |
Tolerance | ±10% | |
Dimensions | 1 x 0.5 x 0.5mm | |
Length | 1mm | |
Depth | 0.5mm | |
Height | 0.5mm | |
Series | GMD | |
Minimum Operating Temperature | -55°C | |
Maximum Operating Temperature | +85°C | |
Terminal Type | Solder | |
Select all | ||
---|---|---|
Brand Murata | ||
Capacitance 1µF | ||
Voltage 6.3V dc | ||
Package/Case 0402 (1005M) | ||
Mounting Type Surface Mount | ||
Dielectric X5R | ||
Tolerance ±10% | ||
Dimensions 1 x 0.5 x 0.5mm | ||
Length 1mm | ||
Depth 0.5mm | ||
Height 0.5mm | ||
Series GMD | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +85°C | ||
Terminal Type Solder | ||
- COO (Country of Origin):
- JP
These capacitors have gold-plated electrodes and are designed specifically for wire bonding and use of gold-tin (AuSn) solder.
Designed specifically for wire bonding and use of gold-tin (AuSn) solder
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder
Ideal for mounting in packages, such as optical communication related devices , IC and etc
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting
Contributes to the miniaturization of the set
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch)
Applications
Various device related,such as GaAsIC (mounted in IC packages)
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder
Ideal for mounting in packages, such as optical communication related devices , IC and etc
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting
Contributes to the miniaturization of the set
Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch)
Applications
Various device related,such as GaAsIC (mounted in IC packages)