TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- RS Stock No.:
- 183-5892P
- Mfr. Part No.:
- CGA6N3X7R2A225K230AE
- Brand:
- TDK
Bulk discount available
Subtotal 100 units (supplied on a continuous strip)*
£56.80
(exc. VAT)
£68.20
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 16 January 2026
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Units | Per unit |
|---|---|
| 100 - 240 | £0.568 |
| 250 - 490 | £0.542 |
| 500 + | £0.502 |
*price indicative
- RS Stock No.:
- 183-5892P
- Mfr. Part No.:
- CGA6N3X7R2A225K230AE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 2.2µF | |
| Voltage | 50V dc | |
| Package/Case | 1210 (3225M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 3.2 x 2.5 x 2.5mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 3.2mm | |
| Depth | 2.5mm | |
| Height | 2.5mm | |
| Series | CGA | |
| Terminal Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 2.2µF | ||
Voltage 50V dc | ||
Package/Case 1210 (3225M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 3.2 x 2.5 x 2.5mm | ||
Automotive Standard AEC-Q200 | ||
Length 3.2mm | ||
Depth 2.5mm | ||
Height 2.5mm | ||
Series CGA | ||
Terminal Type Solder | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor Soft termination CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and smart-key.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and smart-key.