TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
- RS Stock No.:
- 183-5876P
- Mfr. Part No.:
- C5750X7T2E225K250KE
- Brand:
- TDK
Bulk discount available
Subtotal 25 units (supplied on a continuous strip)*
£83.50
(exc. VAT)
£100.25
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 980 unit(s) ready to ship
- Plus 999,999,015 unit(s) shipping from 15 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
25 - 95 | £3.34 |
100 - 245 | £3.258 |
250 + | £3.176 |
*price indicative
- RS Stock No.:
- 183-5876P
- Mfr. Part No.:
- C5750X7T2E225K250KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TDK | |
Capacitance | 2.2µF | |
Voltage | 250V dc | |
Package/Case | 2220 (5750M) | |
Mounting Type | Surface Mount | |
Dielectric | X7T | |
Tolerance | ±10% | |
Dimensions | 5.7 x 5 x 2.5mm | |
Length | 5.7mm | |
Depth | 5mm | |
Height | 2.5mm | |
Series | C | |
Minimum Operating Temperature | -55°C | |
Terminal Type | Solder | |
Maximum Operating Temperature | +125°C | |
Select all | ||
---|---|---|
Brand TDK | ||
Capacitance 2.2µF | ||
Voltage 250V dc | ||
Package/Case 2220 (5750M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±10% | ||
Dimensions 5.7 x 5 x 2.5mm | ||
Length 5.7mm | ||
Depth 5mm | ||
Height 2.5mm | ||
Series C | ||
Minimum Operating Temperature -55°C | ||
Terminal Type Solder | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor Soft termination General grade C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.