TDK 10μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD

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Subtotal 100 units (supplied on a continuous strip)*

£48.00

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£58.00

(inc. VAT)

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Packaging Options:
RS Stock No.:
179-5973P
Mfr. Part No.:
C3225X7S1H106K250AE
Brand:
TDK
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Brand

TDK

Capacitance

10µF

Voltage

50V dc

Package/Case

1210 (3225M)

Mounting Type

Surface Mount

Dielectric

X7S

Tolerance

±10%

Dimensions

3.2 x 2.5 x 2.5mm

Length

3.2mm

Depth

2.5mm

Height

2.5mm

Series

C

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Suppression Class

Class 2

COO (Country of Origin):
JP

TDK 1210 (3225M) MLCC SMD


The TDK 1210 (3225M) surface mount MLCC has a capacitance of 10μF. It is a product in which conductive resin layers are included. Soft termination series have higher mechanical endurance by the flexible resin layers which absorb thermal and mechanical stress. TDK Soft Termination Series is designed for use in applications where significant board flex may occur, especially in safety or high-reliability designs. Safety-critical automotive applications such as ABS, ESP, airbags and battery line applications commonly utilize Soft Termination Capacitors from TDK. Conventional termination materials used in standard MLCCs are inflexible, giving vibration, shock, or thermal expansion and contraction the potential to crack or shear the solder joint between the component and the circuit board. In automotive applications, which are exposed to shock and vibration and to extreme temperature swings, this can result in higher failure rates. TDK's new Soft Termination Capacitors provide very high resistance to mechanical and thermal stress to ensure the component can meet the requirements of automotive OEMs.

Features and Benefits


• C0G temperature characteristic which has an excellent stable temperature
• Higher mechanical endurance
• Operating temperature ranges between -55°C and 125°C
• X8R type which means maximum temperature is up to 150°C is applicable

Applications


• Fail-safe design in battery line
• Prevention of ceramic body cracks by board bending
• Prevention of solder cracks by thermal shock
• The set having a high probability of fall