TDK 1μF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±20% , SMD
- RS Stock No.:
- 179-5504
- Mfr. Part No.:
- CGA9N3X7R2E105M230KE
- Brand:
- TDK
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 179-5504
- Mfr. Part No.:
- CGA9N3X7R2E105M230KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 1µF | |
| Voltage | 250V dc | |
| Package/Case | 2220 (5750M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±20% | |
| Dimensions | 5.7 x 5 x 2.3mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 5.7mm | |
| Depth | 5mm | |
| Height | 2.3mm | |
| Series | CGA | |
| Suppression Class | Class 2 | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +125°C | |
Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 1µF | ||
Voltage 250V dc | ||
Package/Case 2220 (5750M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±20% | ||
Dimensions 5.7 x 5 x 2.3mm | ||
Automotive Standard AEC-Q200 | ||
Length 5.7mm | ||
Depth 5mm | ||
Height 2.3mm | ||
Series CGA | ||
Suppression Class Class 2 | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key