TDK 100nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD

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Subtotal (1 reel of 500 units)*

£14.00

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£17.00

(inc. VAT)

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500 - 500£0.028£14.00
1000 - 2000£0.026£13.00
2500 - 4500£0.023£11.50
5000 - 9500£0.02£10.00
10000 +£0.018£9.00

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RS Stock No.:
179-5358
Mfr. Part No.:
CGA3E2X7R1H104K080AE
Brand:
TDK
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Brand

TDK

Capacitance

100nF

Voltage

50V dc

Package/Case

0603 (1608M)

Mounting Type

Surface Mount

Dielectric

X7R

Tolerance

±10%

Dimensions

1.6 x 0.8 x 0.8mm

Length

1.6mm

Automotive Standard

AEC-Q200

Depth

0.8mm

Height

0.8mm

Series

CGA

Maximum Operating Temperature

+125°C

Minimum Operating Temperature

-55°C

Suppression Class

Class 2

COO (Country of Origin):
JP

TDK 0603 (1608M) MLCC SMD


The TDK 0603 (1608M) surface mount MLCC has a capacitance of 100nF. It is a product in which conductive resin layers are included in terminations. Soft termination series have higher mechanical endurance by the flexible resin layers which absorb thermal and mechanical stress. TDK CGA Series MLCC is AEC-Q200 rated. The CGA Series MLCC's from TDK are manufactured using a tested and stable manufacturing process and subjected to increased inspections that guarantee a higher level of reliability. This capacitor is available in general voltages up to 50V, mid-voltage up to 630V and up to 150°C operating temperature. In addition, thinner ceramic dielectric layers and multilayer technology give these capacitors a large capacitance. The series is available in Standard, Flexible (Soft) and Conductive Epoxy terminations. The CGA Series is used in a variety of applications, including automotive powertrain systems and safety equipment, smart meters, power supplies, sensor modules and higher reliability/safety applications.

Features and Benefits


• C0G temperature characteristic which has an excellent stable temperature
• Higher mechanical endurance
• Operating temperature ranges between -55°C and 125°C
• X8R type which means maximum temperature is up to 150°C is applicable

Applications


• Fail-safe design in battery line
• Prevention of ceramic body cracks by board bending
• Prevention of solder cracks by thermal shock
• The set having a high probability of fall such as keyless entry and smart key