TDK 2.2μF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±20% , SMD
- RS Stock No.:
- 111-0581
- Mfr. Part No.:
- C5750X7T2E225M250KE
- Brand:
- TDK
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 111-0581
- Mfr. Part No.:
- C5750X7T2E225M250KE
- Brand:
- TDK
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TDK | |
Capacitance | 2.2µF | |
Voltage | 250V dc | |
Package/Case | 2220 (5750M) | |
Mounting Type | Surface Mount | |
Dielectric | X7T | |
Tolerance | ±20% | |
Dimensions | 5.7 x 5 x 2.5mm | |
Length | 5.7mm | |
Depth | 5mm | |
Height | 2.5mm | |
Series | C | |
Maximum Operating Temperature | +125°C | |
Minimum Operating Temperature | -55°C | |
Terminal Type | Surface Mount | |
Select all | ||
---|---|---|
Brand TDK | ||
Capacitance 2.2µF | ||
Voltage 250V dc | ||
Package/Case 2220 (5750M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±20% | ||
Dimensions 5.7 x 5 x 2.5mm | ||
Length 5.7mm | ||
Depth 5mm | ||
Height 2.5mm | ||
Series C | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
Terminal Type Surface Mount | ||
- COO (Country of Origin):
- JP
TDK C Series 2220 (5750) Soft Terminal
Soft Termination C Series MLCC have improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties
thermal shock resistance, and heat cycle properties
Conductive resin absorb external stress to protect solder joint parts and capacitor body
Compliance with the RoHS Directive
Compliance with the RoHS Directive
Applications:
Switching power supply
Telecom base station
Electronic circuits mounted on alumina substrate
SMT application which requires bending robustness in which solder joint reliability is problematic
Telecom base station
Electronic circuits mounted on alumina substrate
SMT application which requires bending robustness in which solder joint reliability is problematic