Infineon 32-bit ARM Cortex M4, XMC4500 Microcontroller, 144-Pin LFBGA

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Packaging Options:
RS Stock No.:
260-5250
Mfr. Part No.:
XMC4500E144X1024ACXQSA1
Brand:
Infineon
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Brand

Infineon

Family Name

XMC4500

Package Type

LFBGA

Pin Count

144

Device Core

32-bit ARM Cortex M4

Infineon Microcontroller, 32-bit ARM Cortex M4 Core, 1024kByte Program Memory - XMC4500E144X1024ACXQSA1


This microcontroller is designed for robust industrial applications. It features a compact LFBGA package, with a pin count of 144, and includes a powerful 32-bit ARM Cortex M4 processor that operates at frequencies of up to 120MHz. The device boasts an extensive program memory capacity of 1024kByte and offers operating temperature

Features & Benefits


• 128 to 160KB RAM ensures efficient data handling
• Four 12-bit ADCs provide precise signal measurement
• Integrated Flash memory enhances data retention
• Supports a typical operating supply voltage of 3.3V
• Operates effectively at a maximum temperature of +105°C

Applications


• Utilised in automation control systems for enhanced productivity
• Suitable for motor control in various machinery
• Implemented in power conversion systems for efficiency
• Used for industrial sensing and control tasks
• Applied in connectivity solutions across diverse industrial sectors

What specifications ensure this microcontroller is suitable for automation tasks?


The microcontroller's three CAN channels facilitate seamless communication in automation networks. Its high processing speed of 120MHz ensures rapid data processing, vital for automation tasks, while the ADCs provide accurate sensing capabilities.

How does the memory capacity influence the capabilities of this microcontroller?


The onboard Flash memory of 1024kByte allows for extensive programme storage, which is crucial for complex applications requiring large data sets or sophisticated algorithms.

How does the LFBGA package facilitate the microcontroller’s use in various applications?


The LFBGA package provides a compact footprint while maintaining the robust connectivity needed for industrial applications, supporting high-density designs and effective thermal management.

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