Panasonic Simulated Roller Lever Micro Switch, Solder Terminal, 2 A @ 30 V dc, SP-CO, IP50
- RS Stock No.:
- 173-8257
- Mfr. Part No.:
- ABS141450
- Brand:
- Panasonic
Subtotal (1 box of 100 units)*
£285.60
(exc. VAT)
£342.70
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 100 unit(s) shipping from 20 October 2025
- Plus 300 unit(s) shipping from 03 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Box* |
|---|---|---|
| 100 + | £2.856 | £285.60 |
*price indicative
- RS Stock No.:
- 173-8257
- Mfr. Part No.:
- ABS141450
- Brand:
- Panasonic
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Panasonic | |
| Actuator Type | Simulated Roller Lever | |
| Terminal Type | Solder | |
| Contact Current Rating | 2 A @ 30 V dc | |
| Contact Configuration | SP-CO | |
| IP Rating | IP50 | |
| Operating Force | 0.54 N | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | +85°C | |
| Contact Material | Silver Nickel Alloy | |
| Mechanical Life | 5 x 10^6Operations | |
| Release Force | 0.034N | |
| Operating Temperature Range | -40 → +85°C | |
Select all | ||
|---|---|---|
Brand Panasonic | ||
Actuator Type Simulated Roller Lever | ||
Terminal Type Solder | ||
Contact Current Rating 2 A @ 30 V dc | ||
Contact Configuration SP-CO | ||
IP Rating IP50 | ||
Operating Force 0.54 N | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature +85°C | ||
Contact Material Silver Nickel Alloy | ||
Mechanical Life 5 x 10^6Operations | ||
Release Force 0.034N | ||
Operating Temperature Range -40 → +85°C | ||
- COO (Country of Origin):
- JP
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Subminiature size
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type
Sealed construction
Elastomer double moulding technology and ultrasonic swaging technology contribute to uniform sealing
Expansion of low-level circuit type