TE Connectivity 0.5mm Pitch 200, 260 Way, Right Angle Board Mount Mount Small Outline DIMM Socket ,1.2 V ,500mA
- RS Stock No.:
- 481-965
- Mfr. Part No.:
- 2309410-3
- Brand:
- TE Connectivity
Subtotal (1 reel of 400 units)*
£481.60
(exc. VAT)
£577.92
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 24 November 2025
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Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | £481.60 | £1.204 |
*price indicative
- RS Stock No.:
- 481-965
- Mfr. Part No.:
- 2309410-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Gender | Female | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 200, 260 | |
| Pitch | 0.5mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | Small Outline | |
| Current Rating | 500mA | |
| Voltage Rating | 1.2 V | |
Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Gender Female | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 200, 260 | ||
Pitch 0.5mm | ||
Mounting Type Board Mount | ||
SDRAM Type Small Outline | ||
Current Rating 500mA | ||
Voltage Rating 1.2 V | ||
- COO (Country of Origin):
- CN
The TE Connectivity small outline (SO) DIMM socket is designed for high-performance memory applications, ensuring reliable connectivity in compact spaces. With a stack height of just 5.2 mm, this connector accommodates a right-angle module orientation, making it ideal for slim devices where space is at a premium. Its capability to support both 200 and 260 positions allows for flexibility in various DDR4 memory configurations. Engineered to meet stringent quality standards, this socket connection integrates seamlessly into printed circuit boards (PCBs), bolstering stability and performance. Perfectly suited for modern computing needs, this versatile solution is an essential component for efficient data transfer in cutting-edge technology.
Designed for easy surface mount termination
Enhanced reliability with copper alloy contact base material
High-temperature thermoplastic housing for durability in adverse conditions
Retention posts positioned at both ends for secure placement
Locking ejectors ensure stable module engagement
Enhanced reliability with copper alloy contact base material
High-temperature thermoplastic housing for durability in adverse conditions
Retention posts positioned at both ends for secure placement
Locking ejectors ensure stable module engagement