Infineon FP150R12N3T7BPSA1 3 Phase IGBT, 150 A 1200 V, 43-Pin Module, Chassis Mount
- RS Stock No.:
- 232-6703P
- Mfr. Part No.:
- FP150R12N3T7BPSA1
- Brand:
- Infineon
Bulk discount available
Subtotal 2 units (supplied in a tray)*
£242.54
(exc. VAT)
£291.04
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 10 unit(s) shipping from 24 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
|---|---|
| 2 - 2 | £121.27 |
| 3 + | £116.16 |
*price indicative
- RS Stock No.:
- 232-6703P
- Mfr. Part No.:
- FP150R12N3T7BPSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 150 A | |
| Maximum Collector Emitter Voltage | 1200 V | |
| Maximum Gate Emitter Voltage | ±20V | |
| Number of Transistors | 7 | |
| Maximum Power Dissipation | 20 mW | |
| Configuration | 3 Phase | |
| Package Type | Module | |
| Mounting Type | Chassis Mount | |
| Channel Type | N | |
| Pin Count | 43 | |
| Transistor Configuration | 3 Phase | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 150 A | ||
Maximum Collector Emitter Voltage 1200 V | ||
Maximum Gate Emitter Voltage ±20V | ||
Number of Transistors 7 | ||
Maximum Power Dissipation 20 mW | ||
Configuration 3 Phase | ||
Package Type Module | ||
Mounting Type Chassis Mount | ||
Channel Type N | ||
Pin Count 43 | ||
Transistor Configuration 3 Phase | ||
The Infineon's EconoPIM 3, 150 A three phase PIM IGBT module comes with TRENCHSTOP IGBT7, Emitter Controlled 7 diode and NTC. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings. Potential applications include auxiliary inverters, motor drives and servo drives.
RoHS-compliant modules
Copper base plate for optimized heat spread
High power density
Copper base plate for optimized heat spread
High power density
