Infineon FS1150R08A8P3LBCHPSA1 Half Bridge IGBT, 1.15 kA 750 V, Screw Mount
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Brand:
- Infineon
Subtotal (1 unit)*
£843.64
(exc. VAT)
£1,012.37
(inc. VAT)
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- Shipping from 02 November 2026
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Units | Per unit |
|---|---|
| 1 + | £843.64 |
*price indicative
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 1.15 kA | |
| Maximum Collector Emitter Voltage | 750 V | |
| Number of Transistors | 6 | |
| Configuration | Half Bridge | |
| Mounting Type | Screw Mount | |
| Channel Type | N | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 1.15 kA | ||
Maximum Collector Emitter Voltage 750 V | ||
Number of Transistors 6 | ||
Configuration Half Bridge | ||
Mounting Type Screw Mount | ||
Channel Type N | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology