TE Connectivity 0.85mm Pitch 3647 Way SMT LGA Prototyping IC Socket
- RS Stock No.:
- 185-5919P
- Mfr. Part No.:
- 2-2822979-3
- Brand:
- TE Connectivity
Discontinued
- RS Stock No.:
- 185-5919P
- Mfr. Part No.:
- 2-2822979-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| IC Socket Type | Prototyping Socket | |
| Package Type | LGA | |
| Gender | Female | |
| Number of Contacts | 3647 | |
| Pitch | 0.85mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Current Rating | 500.0mA | |
| Socket Mounting Type | Surface Mount | |
| Device Mounting Type | Surface Mount | |
| Termination Method | Solder | |
| Housing Material | Thermoplastic | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
IC Socket Type Prototyping Socket | ||
Package Type LGA | ||
Gender Female | ||
Number of Contacts 3647 | ||
Pitch 0.85mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Current Rating 500.0mA | ||
Socket Mounting Type Surface Mount | ||
Device Mounting Type Surface Mount | ||
Termination Method Solder | ||
Housing Material Thermoplastic | ||
TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling. As one of a limited number of suppliers of this technology, TE is your dependable socket partner to support current and future Intel CPU processor designs
APPLICATIONS
Servers
Data Centers
High Performance Computing (HPC)
Servers
Data Centers
High Performance Computing (HPC)