Amphenol Communications Solutions 81 Way SMT BGA Prototyping Prototyping Socket
- RS Stock No.:
- 182-2278
- Mfr. Part No.:
- 55714-102LF
- Brand:
- Amphenol ICC
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 182-2278
- Mfr. Part No.:
- 55714-102LF
- Brand:
- Amphenol ICC
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| IC Socket Type | Prototyping Socket | |
| Package Type | BGA | |
| Gender | Male | |
| Number of Contacts | 81 | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Current Rating | 450.0mA | |
| Socket Mounting Type | Surface Mount | |
| Device Mounting Type | Surface Mount | |
| Voltage Rating | 200.0 V | |
| Termination Method | Through Hole | |
| Housing Material | Liquid Crystal Polymer | |
Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
IC Socket Type Prototyping Socket | ||
Package Type BGA | ||
Gender Male | ||
Number of Contacts 81 | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Current Rating 450.0mA | ||
Socket Mounting Type Surface Mount | ||
Device Mounting Type Surface Mount | ||
Voltage Rating 200.0 V | ||
Termination Method Through Hole | ||
Housing Material Liquid Crystal Polymer | ||
- COO (Country of Origin):
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
81 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free