TE Connectivity 1366 Way SMT LGA Prototyping IC Socket
- RS Stock No.:
- 478-441
- Mfr. Part No.:
- 1981837-2
- Brand:
- TE Connectivity
Subtotal (1 tray of 12 units)*
£217.82
(exc. VAT)
£261.38
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 24 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £217.82 | £18.152 |
*price indicative
- RS Stock No.:
- 478-441
- Mfr. Part No.:
- 1981837-2
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
IC Socket Type | Prototyping Socket | |
Package Type | LGA | |
Number of Contacts | 1366 | |
Socket Mounting Type | Surface Mount | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
IC Socket Type Prototyping Socket | ||
Package Type LGA | ||
Number of Contacts 1366 | ||
Socket Mounting Type Surface Mount | ||
- COO (Country of Origin):
- CN
The TE Connectivity Socket assembly LGA1366, designed specifically for high-performance computing applications, delivers reliable connectivity with an emphasis on durability and efficiency. Constructed to accommodate various operational requirements, this component supports seamless integration in advanced configurations. With a focus on compliance, the design adheres to critical industry standards, making it ideal for use in environments where regulatory adherence is paramount. This product stands out in its ability to maintain efficient thermal management and electrical performance under demanding conditions, catering to the needs of engineers and designers alike. Its low halogen content further enhances its environmental credentials, ensuring it meets modern sustainability expectations.
Designed to support sophisticated LGA1366 processor configurations
Low halogen content ensures compliance with environmental regulations
Built for reliable thermal management during high-stress operations
Facilitates easy integration with existing modular systems
Constructed for enhanced durability, adapting to various industrial applications
Backed by comprehensive compliance documentation for peace of mind
Optimised for reflow solder processes with high-temperature capabilities
Low halogen content ensures compliance with environmental regulations
Built for reliable thermal management during high-stress operations
Facilitates easy integration with existing modular systems
Constructed for enhanced durability, adapting to various industrial applications
Backed by comprehensive compliance documentation for peace of mind
Optimised for reflow solder processes with high-temperature capabilities