Heatsink, D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors, 15°C/W, 25.91 x 14.99 x 9.52mm,
- RS Stock No.:
- 880-6008
- Mfr. Part No.:
- 7106DG
- Brand:
- AAVID THERMALLOY
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 880-6008
- Mfr. Part No.:
- 7106DG
- Brand:
- AAVID THERMALLOY
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | AAVID THERMALLOY | |
| For Use With | D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors | |
| Length | 25.91mm | |
| Width | 14.99mm | |
| Height | 9.52mm | |
| Dimensions | 25.91 x 14.99 x 9.52mm | |
| Thermal Resistance | 15°C/W | |
| Mounting | Horizontal | |
| Series | 7106 | |
| Application | Through Hole Discrete Semiconductors | |
| Material | Aluminium | |
| Package Type | SMT | |
| Finish | Tin Plated | |
| Special Features | The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink | |
Select all | ||
|---|---|---|
Brand AAVID THERMALLOY | ||
For Use With D2 PAK (TO-263), Power SO-10 (MO-184), SO-10 Package Semiconductors | ||
Length 25.91mm | ||
Width 14.99mm | ||
Height 9.52mm | ||
Dimensions 25.91 x 14.99 x 9.52mm | ||
Thermal Resistance 15°C/W | ||
Mounting Horizontal | ||
Series 7106 | ||
Application Through Hole Discrete Semiconductors | ||
Material Aluminium | ||
Package Type SMT | ||
Finish Tin Plated | ||
Special Features The Device and the Heat Sink are Soldered Directly to a Modified Drain Pad Creating a Thermal Transfer Path from Package Tab to the Heat Sink | ||
- COO (Country of Origin):
- CN
D-PAK Heatsinks, Aavid Thermalloy
Surface mount heatsink for D-PAK package semiconductors
The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package
tab to the heat sink
The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package
tab to the heat sink
D-PAK Package Heatsinks
