A range of BGA heatsinks with thermally conductive adhesive tape mounting.
Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin Fin array allows omni-directional airflow to maximize heat dissipation
BGA Heatsinks
Attribute
Value
For Use With
Metal/Ceramic BGA Packages
Length
35mm
Width
35mm
Height
7mm
Dimensions
35 x 35 x 7mm
Thermal Resistance
31.9°C/W
Mounting
Surface Mount
Colour
Black
Series
3718
Application
IC Packages
Package Type
BGA
Material
Aluminium
Special Features
Convenient Peel and Stick Assembly is Quick and Clean, Pin Fin Array Allows Omnidirectional Airflow to Maximize Heat Dissipation
Finish
Black Anodized
COO (Country of Origin):
CN
Be the first to know about our latest products and services
Join our mailing list today:
The personal information you provide to us when signing up to the mailing list will be processed in line with our privacy policy.
