Heatsink, Metal/Ceramic BGA Packages, 31.9°C/W, 35 x 35 x 7mm, Surface Mount
- RS Stock No.:
- 880-5831
- Mfr. Part No.:
- 371824B00032G
- Brand:
- AAVID THERMALLOY
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 880-5831
- Mfr. Part No.:
- 371824B00032G
- Brand:
- AAVID THERMALLOY
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | AAVID THERMALLOY | |
| For Use With | Metal/Ceramic BGA Packages | |
| Length | 35mm | |
| Width | 35mm | |
| Height | 7mm | |
| Dimensions | 35 x 35 x 7mm | |
| Thermal Resistance | 31.9°C/W | |
| Mounting | Surface Mount | |
| Series | 3718 | |
| Colour | Black | |
| Package Type | BGA | |
| Material | Aluminium | |
| Application | IC Packages | |
| Finish | Black Anodized | |
| Special Features | Convenient Peel and Stick Assembly is Quick and Clean, Pin Fin Array Allows Omnidirectional Airflow to Maximize Heat Dissipation | |
Select all | ||
|---|---|---|
Brand AAVID THERMALLOY | ||
For Use With Metal/Ceramic BGA Packages | ||
Length 35mm | ||
Width 35mm | ||
Height 7mm | ||
Dimensions 35 x 35 x 7mm | ||
Thermal Resistance 31.9°C/W | ||
Mounting Surface Mount | ||
Series 3718 | ||
Colour Black | ||
Package Type BGA | ||
Material Aluminium | ||
Application IC Packages | ||
Finish Black Anodized | ||
Special Features Convenient Peel and Stick Assembly is Quick and Clean, Pin Fin Array Allows Omnidirectional Airflow to Maximize Heat Dissipation | ||
- COO (Country of Origin):
- CN
BGA Heatsink, Tape mounting
A range of BGA heatsinks with thermally conductive adhesive tape mounting.
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation
BGA Heatsinks