A range of BGA heatsinks with thermally conductive adhesive tape mounting.
Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin Fin array allows omni-directional airflow to maximize heat dissipation
BGA Heatsinks
Attribute
Value
For Use With
Metal/Ceramic BGA Packages
Length
35mm
Width
35mm
Height
7mm
Dimensions
35 x 35 x 7mm
Thermal Resistance
31.9°C/W
Mounting
Surface Mount
Colour
Black
Series
3718
Material
Aluminium
Package Type
BGA
Application
IC Packages
Special Features
Convenient Peel and Stick Assembly is Quick and Clean, Pin Fin Array Allows Omnidirectional Airflow to Maximize Heat Dissipation
