RS PRO Heatsink, Universal Rectangular Alu, 26.5K/W, 14 x 14 x 10mm, Adhesive Foil

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Subtotal (1 bag of 5 units)*

£6.84

(exc. VAT)

£8.21

(inc. VAT)

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In Stock
  • 464 unit(s) ready to ship
  • Plus 500 unit(s) shipping from 13 November 2025
  • Plus 540 unit(s) shipping from 08 January 2026
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Bag(s)
Per Bag
Per unit*
1 - 9£6.84£1.368
10 - 24£6.29£1.258
25 - 49£6.03£1.206
50 - 99£5.82£1.164
100 +£5.34£1.068

*price indicative

RS Stock No.:
750-0881
Brand:
RS PRO
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Brand

RS PRO

For Use With

Universal Rectangular Alu

Length

14mm

Width

14mm

Height

10mm

Dimensions

14 x 14 x 10mm

Thermal Resistance

26.5K/W

Mounting

Adhesive Foil

Colour

Black

Application

Semiconductor Devices

Package Type

BGA

Material

Aluminium

Finish

Anodized

COO (Country of Origin):
GB

BGA Heatsink, Standard


Standard type BGA heatsink suitable for a variety of applications.

RS PRO Heatsink - Adhesive Foil, 14 mm x 14 mm x 10 mm


The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.
Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.

Why Would You Choose This Heatsink?


The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.

Features and Benefits


  • BGA heatsink

  • Standard, Pushpin

  • Made from aluminium

  • Adhesive foil mounting

  • Anodized finish

  • For use with Universal rectangular Alu

  • Thermal resistance 10.5° C/W

Dimensions


  • 14 mm x 14 mm x 10 mm

Applications


  • Integrated Circuits

  • PCB


BGA Heatsinks

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